Power chips are linked to external circuits with packaging, and their performance depends on the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power modules. Chip interconnection describes the electrical link on the upper surface area of the chip, which is typically aluminum bonding wire in traditional modules. ^
Conventional power module plan cross-section
Currently, commercial silicon carbide power components still mainly use the product packaging innovation of this wire-bonded standard silicon IGBT module. They encounter troubles such as large high-frequency parasitic criteria, inadequate warm dissipation ability, low-temperature resistance, and inadequate insulation toughness, which limit making use of silicon carbide semiconductors. The display of outstanding performance. In order to fix these troubles and completely manipulate the big prospective benefits of silicon carbide chips, many new packaging innovations and solutions for silicon carbide power modules have arised in recent times.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually established from gold cords to copper cords, and the driving pressure is expense reduction; high-power gadgets have actually created from aluminum wires (strips) to Cu Clips, and the driving force is to improve product efficiency. The greater the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to attach chips and pins. Compared with typical bonding product packaging techniques, Cu Clip technology has the following benefits:
1. The connection in between the chip and the pins is made from copper sheets, which, to a certain extent, changes the common cord bonding technique in between the chip and the pins. As a result, a special plan resistance value, higher current flow, and far better thermal conductivity can be gotten.
2. The lead pin welding area does not need to be silver-plated, which can fully save the expense of silver plating and poor silver plating.
3. The product look is entirely constant with regular items and is mostly used in web servers, mobile computers, batteries/drives, graphics cards, motors, power materials, and other areas.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding technique is extra expensive and complex, however it can attain far better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding technique
The source pad utilizes a Clip approach, and the Gate makes use of a Wire technique. This bonding approach is slightly more affordable than the all-copper bonding approach, conserving wafer area (suitable to really small gate locations). The procedure is easier than the all-copper bonding method and can obtain much better Rdson and better thermal impact.
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